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VEECO INSTRUMENTS INC (VECO)·Q1 2025 Earnings Summary
Executive Summary
- Q1 2025 revenue was $167.3M and non-GAAP diluted EPS was $0.37; both were above guidance midpoints, with EPS above the high end. The Semiconductor segment grew sequentially and year-over-year on Advanced Packaging strength .
- Versus consensus, revenue beat by ~$1.3M and EPS beat by ~$0.05, driven by wet processing and lithography shipments and continued laser annealing strength at leading-edge customers; margins were stable with non-GAAP gross margin at ~41.7% .
- Management set Q2 2025 guidance to $135–$165M revenue and $0.12–$0.32 non-GAAP EPS, with a wider range due to China tariff-related shipment delays (~$15M assumption) and ~100 bps gross margin impact from tariffs and lower volumes .
- Strategic catalysts: Intel’s 2025 EPIC Supplier Award, over $35M AP300 lithography orders, and wet processing qualifications at a global IDM strengthen the Advanced Packaging and annealing narratives tied to AI/HPC demand .
What Went Well and What Went Wrong
What Went Well
- Advanced Packaging momentum: “Revenue above mid-point of guidance, EPS above guidance… Growth driven by wet processing and lithography system shipments in Advanced Packaging” .
- Strategic wins in annealing: “Two leading logic customers designated Veeco’s laser spike annealing platform as production tool of record for new applications at their most advanced gate-all-around nodes” .
- Commercial traction: Over $35M of AP300 lithography orders from IDM/OSAT customers; deliveries in 2025 supporting AI/HPC capacity expansions .
What Went Wrong
- Tariff headwinds: Management expects ~$15M of Q2 shipments to China to be delayed due to tariffs; gross margin guidance incorporates ~100 bps impact from tariffs and lower volumes .
- End-market softness: Data Storage systems revenue was zero in Q1; revenue only from service/aftermarket; no system shipments expected in 2025 .
- Scientific & Other normalization: Scientific revenue fell to $22M from $33M in Q4 2024 as activity normalized; moderating sequential momentum outside Semi .
Financial Results
Consolidated Performance vs Prior Periods and Estimates
Values retrieved from S&P Global for consensus (marked with *).
Note: Non-GAAP EPS beat vs consensus; GAAP EPS lags due to non-GAAP adjustments .
Segment/End-Market Revenue Mix
Geographic Revenue Mix
KPIs and Balance Sheet Highlights
Guidance Changes
Earnings Call Themes & Trends
Management Commentary
- “Veeco was awarded Intel's 2025 EPIC Supplier Award… validates us as a top supplier in the semiconductor industry.” — Bill Miller, CEO .
- “Two leading logic customers [designated] Veeco’s laser spike annealing platform as production tool of record for new applications at their most advanced gate-all-around nodes.” — Bill Miller, CEO .
- “Q2 revenue is expected between $135M and $165M… midpoint assumes ~$15M [China] shipments will be delayed… GM includes ~100 bps impact primarily from lower volumes due to tariffs and tariff-related costs.” — John Kiernan, CFO .
- “Our Advanced Packaging business is going to probably double this year to about $150M in ’25… driven by AI, particularly HBM and 3D device stacking.” — Bill Miller, CEO .
Q&A Highlights
- Advanced Packaging lithography recovery: Management cited capacity additions at IDM/OSATs tied to AI/HPC; AP lithography and wet processing expected to drive ~2x AP revenue in 2025 .
- China tariff mitigation: Customers seeking exemptions; near-term shipments manufactured in U.S. face import tariffs; ~$15M delay embedded in Q2 guide; split across scientific and semiconductor customers .
- Semi outlook components: Gate-all-around and Advanced Packaging expected to double year-over-year and offset China moderation; lithography included within AP numbers .
- GaN Power timeline: Meeting performance requirements; customer pilot in 2026, potential ramp through 2027; no PO yet .
- 2H setup: With tariff uncertainty, management sees second-half business activity similar to first-half levels; Data Storage systems remain off-cycle .
Estimates Context
Values retrieved from S&P Global (consensus values marked with *).
Note: Management widened ranges due to tariff risk (~$15M shipments delayed; ~100 bps GM headwind) .
Key Takeaways for Investors
- Q1 delivered a clean beat on revenue and non-GAAP EPS versus consensus; strength was concentrated in Advanced Packaging and leading-edge annealing; margins held steady .
- Expect near-term volatility as China tariffs delay shipments (~$15M) and compress margins by ~100 bps in Q2; ranges are wider to reflect risk .
- Strategic positioning in AI/HPC packaging and GAA/HBM annealing is improving: AP lithography orders (> $35M) and wet processing qualifications support AP doubling in 2025 .
- Data Storage remains a drag with no system shipments expected in 2025; model service-only revenue in that segment while focusing on Semi growth drivers .
- Watch evaluation-to-HVM conversion cadence (NSA/LSA/IBD300); incremental wins can be $40–$50M per application at 100k WSPM, but timing leans 2026+ .
- Balance sheet is solid with $353M cash/ST investments; working capital up (A/R, inventories) reflecting shipment mix and timing; DSO/DIO increased QoQ .
- Trading setup: Near-term risk skew from tariff visibility; upside tied to continued AI/HPC capacity buys and execution on AP/annealing evaluations; monitor Q2 order intake and tariff exemption progress .